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dc.contributor.advisorLail, Brian
dc.contributor.authorNguyen, Kevin H
dc.date.accessioned2017-05-03T14:16:13Z
dc.date.available2017-05-03T14:16:13Z
dc.date.issued2017-05
dc.identifier.urihttp://hdl.handle.net/11141/1397
dc.descriptionThesis (M.S.) - Florida Institute of Technology, 2017en_US
dc.description.abstractElectromagnetic band gap (EBG) structure with novel meandered lines for mitigation of simultaneous switching noise (SSN) from multiple switch mode power supplies on a high speed digital circuit card assembly is investigated. The electromagnetic band gap structure is designed for a wideband operation from 200 MHz to 15 GHz. The application interest for this planar structure can be used as high impedance surfaces to suppress EMI noise for EMC compliance in Mil-Std-461, which is an electromagnetic compatibility standard for military equipment operating in the frequency range from 10 KHz to 18 GHz. ANSYS HFSS was used for simulation of these electromagnetic band gap structures. First, these structures are investigated by simulating the basic mushroom square patches of 26 mm square dimension in an array of 3 by 5, 2.6 mm spacing is used between patches. Then meandered lines are inserted between the square patches. The base line model is a 3x5 array of 26 mm square patches with 2.6 mm spacing, 0.2 mm width meander lines inserted between the patches and connected to the patches. Next, models are simulated with the meander lines width changed to 0.4 mm and 0.15 mm. These models, 3x5 array of 26 mm square patches with 2.6 mm spacing, 3x5 array of 26 mm square patches with 2.6 mm spacing and 0.2 mm meander lines, 3x5 array of 26 mm square patches with 2.6 mm spacing and 0.15 mm meander lines, 3x5 array of 26 mm square patches with 2.6 mm spacing and 0.4 mm meander lines are fabricated into PCB and measured. S-parameters are measured and observed, in particular S₂₁.en_US
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen_US
dc.rightsCC BY 4.0en_US
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/legalcodeen_US
dc.subjectCapacitanceen_US
dc.subjectDecoupling capacitoren_US
dc.subjectElectromagnetic band gapen_US
dc.subjectElectromagnetic interferenceen_US
dc.subjectElectromagnetic compatibilityen_US
dc.subjectGround planeen_US
dc.subjectHigh impedance surfacesen_US
dc.subjectHigh frequency structural simulatoren_US
dc.subjectInductanceen_US
dc.subjectMeander linesen_US
dc.subjectMetamaterialsen_US
dc.subjectMillimeteren_US
dc.subjectMilen_US
dc.subjectPower distribution networken_US
dc.subjectPrinted circuit boarden_US
dc.subjectPlanar electromagnetic band gapen_US
dc.subjectS-parameteren_US
dc.subjectSimultaneous switching noiseen_US
dc.subjectSwitch mode power suppliesen_US
dc.titlePlanar Electromagnetic Band Gap for Broadband Switching Noise Mitigation in High-Speed PCBen_US
dc.typeThesisen_US
dc.date.updated2017-05-01T20:04:02Z
thesis.degree.nameMaster of Science in Electrical Engineeringen_US
thesis.degree.levelMastersen_US
thesis.degree.disciplineElectrical Engineeringen_US
thesis.degree.departmentElectrical and Computer Engineeringen_US
thesis.degree.grantorFlorida Institute of Technologyen_US
dc.type.materialtext


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