Planar Electromagnetic Band Gap for Broadband Switching Noise Mitigation in High-Speed PCB
Electromagnetic band gap (EBG) structure with novel meandered lines for mitigation of simultaneous switching noise (SSN) from multiple switch mode power supplies on a high speed digital circuit card assembly is investigated. The electromagnetic band gap structure is designed for a wideband operation from 200 MHz to 15 GHz. The application interest for this planar structure can be used as high impedance surfaces to suppress EMI noise for EMC compliance in Mil-Std-461, which is an electromagnetic compatibility standard for military equipment operating in the frequency range from 10 KHz to 18 GHz. ANSYS HFSS was used for simulation of these electromagnetic band gap structures. First, these structures are investigated by simulating the basic mushroom square patches of 26 mm square dimension in an array of 3 by 5, 2.6 mm spacing is used between patches. Then meandered lines are inserted between the square patches. The base line model is a 3x5 array of 26 mm square patches with 2.6 mm spacing, 0.2 mm width meander lines inserted between the patches and connected to the patches. Next, models are simulated with the meander lines width changed to 0.4 mm and 0.15 mm. These models, 3x5 array of 26 mm square patches with 2.6 mm spacing, 3x5 array of 26 mm square patches with 2.6 mm spacing and 0.2 mm meander lines, 3x5 array of 26 mm square patches with 2.6 mm spacing and 0.15 mm meander lines, 3x5 array of 26 mm square patches with 2.6 mm spacing and 0.4 mm meander lines are fabricated into PCB and measured. S-parameters are measured and observed, in particular S₂₁.
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